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In this paper, a chip level stacked module, 100-µm pitch chip on chip (CoC) interconnection with Cu/Sn/Cu microbumps, was assembled by thermal compression bonding process. Daisy chain circuit in the package is electrically connected to high speed Data Acquisition (DAQ) thus transient resistance and drop number are recorded during drop test. The cross-sectional images of failed samples are inspected...
For the purpose of process R&D on inter-die vertical connection for 3D integration, the role of ultrasonic vibration in forming a low-temperature bonding joint needs to be studied in-depth. Rather than focusing on the ultrasonic-induced interfacial reactions by molten solder, this study used low power ultrasonics to bond solder with flat Ni and microcone-structured Ni substrates respectively under...
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