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An ultrasonic bonding technique has been developed for bonding single wall carbon nanotubes (SWNTs) onto metal microelectrodes. The bonding was formed by pressing SWNTs against the electrodes with a vibrating press at an ultrasonic frequency. With this technology, low-resistance contacts are achieved between both metallic and semiconducting SWNTs and electrodes. After bonding, the effective Schottky...
The chip on glass (COG) technique has been developed for excellent resolution and high quality liquid crystal display (LCD) panels for several years. In telecommunication field, the glass of LCD with 0.3mm thickness is used in the real product soon. However, many serious manufacturability and reliability issues were observed in the previous studies. In those, warpage of LCD cell is one of the common...
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