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Electroplating technology for via filling with copper for three-dimensional packaging is one of the strong candidates. The Cu electroplating technology for perfect via filling is discussed in this paper. A plating solution was prepared, in which plating deposition potential was found to be influential on its solution flow rate. The characteristics of organic additives in the plating solution were...
We have developed the two-step Cu electroplating (EP) technique using alkali-metal-free copper pyrophosphate bath for Cu seed enhancement EP step. Alkali-metal-free copper pyrophosphate bath realizes conformal thickening of thin Cu seed layer without dissolution of Cu seed layer due to high resistivity, high polarization, and low Cu dissolubility of the bath. The two-step technique brings excellent...
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