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Bandwidth limitation of current wireless frequency bands and the energy consumption are challenges that have to be addressed by future 5G wireless networks. The millimeter wave (mm-wave) spectrum, spanning 30 GHz to 300 GHz, is a prime candidate to resolve the bandwidth limitation issue in future networks. High-speed electronics, though, are quite energy-inefficient for such mm-wave signal generation...
A hybrid silicon ring laser in which the counter-clockwise circulating power is coupled into the clockwise mode is demonstrated. Unidirectional clockwise laser output is achieved with a suppression ratio of 19 dB over the counter-clockwise mode.
In this paper, we review the current status of the hybrid silicon photonic integration platform with emphasis on its prospects for increased integration complexity. The hybrid silicon platform is maturing fast as increasingly complex circuits are reported with tens of integrated components including on-chip lasers. It is shown that this platform is well positioned and holds great potential to address...
Two types of hybrid silicon tapers are studied. Single taper loss is 0.3 – 0.5 dB, enabling integration of III/V actives on silicon-on-insulator passive circuitry with low loss. Keywords-Hybrid integration, silicon-on-insulator technology
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