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In this paper, a direct IQ modulator MMIC for high speed E-band wireless communication is presented. The IQ modulator consists of two balanced resistive mixer cells, on-chip marchand balun and two Lange couplers for quadrature LO signal generation. When operating as a single side band mixer, it shows conversion loss of 11 dB and side-band suppression higher than 20 dB. LO to RF isolation has been...
In this paper, a highly integrated direct conversion receiver MMIC for high speed E-band wireless communication is presented. The receiver consists of 3-stages LNA, doubler with buffer amplifier, and IQ-mixer. The LNA, doubler and IQ-mixer are also presented separately. The LNA covers 75 to 90 GHz with 15 dB gain and a simulated minimum 5 dB noise figure; doubler covers 75 to 90 GHz with 8 to 12 dBm...
A low-loss, low power consumption monolithic high-temperature superconducting (HTS) Josephson junction mixer at 7–8.5 GHz is presented. The mixer consists of a HTS (YBCO) bandpass filter for RF input, a lowpass filter for IF output and a LO resonator integrated with a single Josephson junction. All the passive and active devices are fabricated on a ...
This paper presents a wafer-level microwave multichip module (MMCM) packaging process for 24GHz driver amplifier using photosensitive-Benzocyclobutene (photo-BCB) of 25 μm. It is developed for multilayer interconnection of monolithic microwave integrated chip (MMIC). A 24 GHz driver amplifier chip is embedded in a wet-etched trench on 4 inch lossy Si wafer and covered with a layer of BCB as dielectrics...
A high sensibility wideband millimeter wave receiver operating in Ka band on the background of imaging concealed objects is presented. The zero-bias direct detecting millimeter receiver achieves an effective bandwidth 7.6 GHz and NF <;3dB which can receive like noise signals that are typical for passive mm-wave imaging. The fundamentals of the system are described. The principle of operation, performance...
In this paper, a process to fabricate BCB/Au multilayer stack on low resistivity Silicon (Si) based on the embedded package structure is developed, especially for the first time spin coating of the dielectric material on the Si substrate. Transmission lines, including micro-strip transmission lines and coplanar waveguide (CPW) lines are designed, fabricated and characterized, which performs excellently:...
This paper analyzes two of the most important discontinuity effects of the transmission line in MMIC design. Both the marginal effect and discontinued ground plane have been considered to avoid deterioration of the circuit. A fully integrated receiver front end MMIC chip which is constructed with a three stage low noise amplifier cascaded with a resistive mixer for millimeter wave down conversion...
A potential large scale QFN package solution-plastic air-cavity QFN package, compatible with SMD assembly lines, for future low cost, miniature size and attractive performance microwave package application is proposed in this paper. A 6 GHz~18 GHz LNA MMIC (2 ?? 1mm2) is developed using a commercial GaAs pHEMT process and integrated into this novel and cost effective package solution. The measured...
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