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This paper presents a modeling approach of the Galden layer formation on the surface of Printed Circuit Boards (PCBs) during the Vapour Phase Soldering (VPS) process. The layer formation model is a supplement of a board level condensation model which calculates the condensate mass on the surface of the soldered PCB (presented in [1]). The Galden layer formation model applies combined transport mechanisms...
This paper presents a modeling approach of vapour condensation during the Vapour Phase Soldering (VPS) process at board level. This model is based on a process (machine) level model which calculates the vapour and temperature space in the VPS tank. The board level condensation model is embedded into the process level model (presented in [1]). The condensation model applies combined transport mechanisms...
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