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In this paper, the average and the range of the condensate layer thickness was investigated in the function of different substrate properties with numerical simulations of Vapour Phase Soldering (VPS). The condensate layer thickness is the main influencing factor during the heat transfer of the VPS process. The phase change on the substrate and the transfer mechanisms in the condensate layer were...
Contact angle measurements of water droplets were carried out on fiberglass epoxy resin and polyimide substrates related to water condensation effect as an antecedent process of electrochemical migration. It was shown in our previous paper that water condensation intensity depends mainly on the surface roughness (which determines capillary condensation) and on the heat diffusivity of the substrate...
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