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In the broad-spectrum of 3D system integration technologies, stacking of die at wafer level is considered a promising and cost effective platform solution for 3D device and 2.5D interposer assembly. The 3D die-to-wafer (D2W) approach consists of a sequence of processes: D2W stacking, wafer-level die encapsulation ("wafer reconstruction") using e.g. wafer-level molding, Wafer thinning, Through...
With the continuous development of 3D technology, il enables different variety in advanced 3D packaging. One oi the 3D package type which is currently being explored is the die-to-wafer (D2W) configuration. The 3D D2W assembly can be packaged using a standard flip chip with a laminate or BGA substrate but it has certain limitation in terms oí deformation induced during processing due to temperature...
Packaging material is one of the key components for through-silicon via (TSV) 2.5D/3D package giving a strong impact on the higher density integration and its reliability.
The cost of 3D process flows is one of the most important aspects for the broader adoption of 3D integration by the semiconductor industry. In this paper the processing cost of the features and components that enable 3D stacking is considered and compared. Different stacking approaches are considered: D2W, W2W and interposer-based stacking. Furthermore, the impact of processing yield and pre-stack...
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