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The busbar has been widely used in electrical & electronic industry because of the demand of the high power transition and the rapid development of the busbar technology. However, with increasingly demand in building applications, it is needed to be developed for the highperformance and multi-functional busbar. This paper introduces the materials used as busbars and then different busbar types...
A multilevel back-end-of-line structure with a dielectric constant κ ≤ 2.4 ultra low-κ materials was developed. κ=2.2 ULK build was demonstrated at a 144nm wiring pitch and a κ=2.4 ULK was demonstrated at a 288nm pitch. Good model-to-hardware correlation for the measured capacitance indicated no significant plasma damage to the ULK 2.2 material. The extracted copper resistivity was consistent with...
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