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A 6.5×6.5 mm2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data transmission applications. First characterizations are described in this paper with a focus on reliability, antenna performances and Through-Silicon-Vias (TSV) characterization. It is first shown that more than 500 thermal cycles can be achieved with...
This work describes an UWB impulse transmitter with integrated antenna in the 60 GHz band implemented in CMOS65nm SOI technology. The transmitter aims low-power short-range high data-rate communication systems for fast-downloading applications. It consists of an oscillator that is switched on-and-off by the digital data to be transmitted and a medium power amplifier. The transmitter is fabricated...
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