The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents a chip-level post-complementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple alternative to spin-coated resist. Unlike conventional photolithography methods, the technique allows resist patterning on very high topography,...
In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and thinned chips. Then, chip-to-chip bonding and TSV fabrication steps are accomplished in wafer-level. A parylene deposition technique developed throughout this research provides a very flat wafer surface after chip embedding, thus, photoresist...
Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter of the TSV, usually omitted, is their depth. This paper discusses the fabrication process, characterization and detailed failure analysis of deep...
This paper presents a robust electrochemical detection system composed of microfabricated electrodes and a potentiostat circuit developed for quantitative detection of biomolecules by Cyclic Voltammetry (CV) measurements. Compared to electrochemical cells employing external counter electrodes (CE) and polymer passivation layers, this system offers more reliable and stable operation owing to on-chip...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.