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The electromigration (EM) behavior of graphene‐doped twinned copper composite (GC–Cu) and nanotwinned copper (NT–Cu) redistributed layers (RDLs) are investigated. Firstly, the GC–Cu has longer lifetimes under various test conditions. For example, the GC–Cu RDL took 291 h to reach a 20% resistance increase, while the NT–Cu RDL took 117 h under the same condition of 120 °C and 106 A cm−2. Secondly,...