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Both copper (Cu) and silver (Ag) have been studied extensively for electrical conductor applications. To expand the applications, two bonding designs were implemented in this paper. For the first design, a 50-$\mu \text{m}$ Ag layer was annealed at 400 °C to increase Ag grain size, thereby making it more ductile. For the second design, a 5-$\mu \text{m}$ Ag layer with cavities was created to release...
Flip-chip interconnect joints of copper/gold (Cu/Au) with 40- diameter and 100- pitch were made between silicon (Si) chips and Cu substrates using solid-state bonding at 200 with a static pressure of 250–400 psi (1.7–2.7 MPa). The array of 5050 Cu/Au columns was first created. In fabrication, photoresist with 5050 cavities of 40- diameter...
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