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Both copper (Cu) and silver (Ag) have been studied extensively for electrical conductor applications. To expand the applications, two bonding designs were implemented in this paper. For the first design, a 50-$\mu \text{m}$ Ag layer was annealed at 400 °C to increase Ag grain size, thereby making it more ductile. For the second design, a 5-$\mu \text{m}$ Ag layer with cavities was created to release...
The purpose of this research is to assess the reliability of Ag–In joints in thermal cycling (TC) environment. Si chips and Cu substrates were bonded using silver (Ag) and indium (In) multilayer structure without applying any flux. After bonding, the samples were annealed in air at 250 °C for 190 h to convert the joint into an alloy of small intermetallic grains and solid solution (Ag). The resulting...
In this research, a fundamental study is conducted to identify the materials and processes for producing bonding/barrier composites on Bi2Te3 for high temperature thermoelectric applications. Pd, Ni, Ni/Au, Ag, and Ti/Au were deposited and evaluated using scanning electron microscope (SEM) and energy dispersive X-ray (EDX). A thermal evaporated, 100nm Ti/100nm Au composite gave the most promising.
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