Search results for: Chin C. Lee
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 4 > 551 - 559
Journal of Electronic Materials > 2014 > 43 > 1 > 9-15
Materials Science & Engineering A > 2005 > 393 > 1-2 > 315-319
Materials Science & Engineering A > 2004 > 374 > 1-2 > 280-284
Materials Science & Engineering A > 2004 > 372 > 1-2 > 261-268
Materials Science & Engineering A > 2002 > 333 > 1-2 > 45 - 50
Thin Solid Films > 2002 > 414 > 2 > 175-179