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The reliability of Au-free Ohmic contacts has been evaluated under a constant current stress (500mA/mm) in a high temperature environment (150°C, 175°C, and 200°C). Two Ohmic contact schemes with different Ti/Al thicknesses (5nm/100nm and 10nm/100nm) have been tested. The results showed that the degradation of the resistance (R increase ) is accelerated at a higher temperature condition. Moreover,...
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