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As the major unit of the electrical energy transformations device, IGBT (Insulated Gate Bipolar Transistor) determines the lifetime of the power device immediately. IGBT module is normally made up of chip, DBC (Direct Bonded Copper), substrate and bonding wire, Due to the different CTE(Coefficient of Thermal Expansion), thermal stress occurs when IGBT module works. which leads to device failure. In...
As the major unit of the electrical energy transformations device, IGBT (Insulated Gate Bipolar Transistor) determines the lifetime of the power device immediately. IGBT module is normally made up of chip, DBC (Direct Bonded Copper), substrate and bonding wire, Due to the different CTE(Coefficient of Thermal Expansion), thermal stress occurs when IGBT module works. which leads to device failure. In...
In recent years, silver alloy wire has been widely used in semiconductor industry. In contrast to conventional gold wire, silver alloy wire has better electrical property, thermal conductivity and lower cost while tends to migrate more easily under high temperature and current density. In this paper, electro-migration (EM) of silver alloy wire after wire bonding has been studied. Under accelerated...
In this paper, the copper property under various ultrasonic powers was firstly investigated by experiment. It is found the ultrasound has an acoustic softening effect on copper free air balls (FABs). The stressstrain behavior of copper FABs that accounted for acoustic softening effect was achieved by combining experiment and numerical simulation. Then a non-linear finite element (FE) model was built...
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