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In this paper, thermal-mechanical reliability of TSV structure was investigated with thermal shock test and finite element method. The fine pitch TSV samples were subjected to thermal load, failure samples were identified by resistance measurement, the calculated characteristic life was about 340 cycles. It is revealed that thermal-mechanical stress is concentrated around TSV, the ends of TSV are...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
Special specimen was designed to study the morphology change of SnAgCu solder under the influence of electromigration (EM) alone. High current stressing was applied to the specimens so that EM of solder would happen at both room and high temperatures. The interfacial crack at cathode is the main failure mode, although the positions of crack maybe different under different temperatures. Localized hillocks...
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