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Package and PCB co-simulation is common in system level companies for the prediction of high-speed channel performance. In recent times, chip companies have been paying closer attention to package and PCB co-simulations in order to guarantee the performances of these chips at the system level. However, full-wave package and PCB co-simulation can be challenging: if the package and PCB are modeled together,...
A method for developing a causal RLGC model from S-parameter measurements is proposed for single-ended transmission lines with the assumption of 2nd order Debye representation for the substrate dielectric medium. Genetic algorithm, an optimization method, is used to find the causal model parameters and the substrate dielectric properties. The measured S-parameter of a stripline with TRL calibration...
An effective method for extracting parameters of a Debye or a Lorentzian dispersive medium over a wideband frequency range using a genetic algorithm (GA) and a transmission-line model is presented. Scattering parameters (S-parameters) of the transmission-line sections, including a parallel plate, microstrip, and stripline, are measured. Wave equations for TEM/quasi-TEM mode with a complex propagation...
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