The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With silicon process technology advanced to 20 nm node and beyond, die size is continuously shrinking. Package cost is very sensitive to the total cost of an entire chip/ASIC (Application-Specific Integrated Circuit). To reduce package cost, either the package layer count needs to be reduced or the package size needs to be decreased. For a given chip/ASIC design, its high-speed IO (Input Output) pin...
This paper presents a fast via tool to predict the via stub length after back-drilling. The fast via tool is developed associated with the physics based via model and is combined with the calculation of plane impedance and via capacitance block by block. The entire via model is built by connecting those via blocks one after another accordingly. The plane impedance is calculated from an analytical...
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.