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Fluxless brazing of bare alumina with Cu was conducted with an ultrasonic-assisted brazing technique by a Zn-14wt.%Al filler. The shear strength of Cu/alumina joints (84MPa) exhibited 27% larger than the alumina/Cu joints (66MPa) due to different intermetallic phases and their morphologies formed in the seam under the same parameters, which are probably attributed to the transmission rate of ultrasonic...
Direct Bonded Copper (DBC) is now commonly applied as heat transfer substrates for high power electronics. The metallizaed surfaces are designed for improving the heat conduction and joining with copper heat sink. However, due to the mismatch of coefficient of thermal expansion, the joining area is usually the failure regions. In the present work, the alumina ceramic substrate and the copper substrate...
Direct Bonded Copper (DBC) is now commonly applied as heat transfer substrates for high power electronics. The metallizaed surfaces are designed for improving the heat conduction and joining with copper heat sink. However, due to the mismatch of coefficient of thermal expansion, the joining area is usually the failure regions. In the present work, the alumina ceramic substrate and the copper substrate...
With the trend of high power, high luminance in the industries of solid-state lighting, the difficulty of heat dissipation gets remarkable. Thermal interfaces in packages are usually the drawbacks or hinders for heat dissipation due to the wide use of high-thermal-conductivity materials. Ceramics, such as alumina, AlN et al. are the cases. In this paper, the copper heat sink was directly bonded with...
The high-conductivity Ce 0.82 La 0.18 O 2−δ (LDC) was synthesized by solid state reaction added with 2.5mol% V 2 O 5 in raw materials, which exhibited a cubic fluorite structure. The addition of V 2 O 5 enhanced greatly the densification (97%) and conductivity (0.0965Scm −1 at 800°C) of the LDC ceramics. The results are ascribed to the...
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