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We developed a micro fabrication process of vibration-based sputtered PZT micro energy harvester with a proof mass. A PZT film as a piezoelectric material is formed on a cantilever by using sputtering. An electric power is generated because of piezoelectric effect when the cantilever is bended and stressed. The device is fabricated on a Si substrate by MEMS techniques. The cantilever had 1200 μm in...
The operation conditions have been improved via developing new technologies and improving the hardware on HL-2A tokamak in recent years. The ECRH system has been upgraded to 3 MW/68 GHz, the supersonic molecular beam injection (SMBI) fuelling technique has been developed further, and clusters can be formed in the SMB by cooling the gas to around liquid nitrogen temperature, so that deeper penetration...
Major efforts are currently underway throughout the IC industry to develop the capability to integrate device chips by stacking them vertically and using through-silicon vias (TSVs). The resulting interconnect density, bandwidth, and compactness achievable by TSV technology exceed what is currently possible by other packaging approaches. Market-driven applications of TSV involving memory include multi-chip...
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