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For a unified power flow controller (UPFC) operated in constant power-flow control mode, a novel control scheme of bus voltage regulation is presented. The voltage magnitudes of the ac buses are monitored in real-time operation and are controlled within their limits by the adjustment of the reactive power setting of the series converter. Firstly, the sensitivity of the voltage magnitudes of ac buses...
This paper analyzes the optimal problems of dc-segmentation for multi-infeed HVDC systems based on stability performance and studies the selecting method for the optimal dc-segmentation scheme. First, three major stability problems of multiinfeed HVDC systems are pointed out, which implies the necessity of the optimization for dc-segmentation. Second, three typical evaluation indices which correspond...
This paper reports on power delivery modeling for 3D systems where through-silicon vias (TSVs) are not uniformly distributed, but are arranged at the peripheries of circuit blocks and die edges. The voltage drop (IR) and di/dt noise on the power delivery are modeled and compared with those given by uniformly distributed TSVs. The impact of TSV density and circuit block size, and their tradeoffs are...
This paper reports on a novel partition and assembly approach that combines both the electromagnetic (EM) and analytical simulations to accurately model and analyze several through-silicon-via (TSV) based 3D power delivery networks, which are composed of various stacked-chips, interposer, and package substrate. With this method, we also analyzed RLC couplings between multiple voltage supply rails...
Decoupling capacitors are essential to reduce high transient current noise and to provide a low impedance power delivery path. 3D technology has several advantages for power delivery, and this work investigates the impacts of decoupling capacitors on through-silicon-via (TSV)-based 3D power networks using a novel hybrid modeling approach, i.e., combining electromagnetic (EM) and SPICE simulations...
It is important to understand how to deliver power into 3D heterogeneous systems, which require different power supplies for different components (e.g., digital, analog, mixed-signal, MEMS parts). This paper reports on a study for a simplified case, where the two power supplies with different voltage levels are uniformly distributed through a TSV-based 3D system. In addition to intrinsic voltage losses...
While three-dimensional (3D) technology has several advantages for power delivery, an integrated chip-level, interposer-level, and package-level power distribution network in through-silicon-via (TSV)-based 3D system has to be modeled and evaluated. This paper reports on modeling of power delivery into 3D chip stacks on a silicon interposer/packaging substrate using a novel hybrid approach, i.e.,...
HVDC plays a very important role in remote and large capacity power transmission in China. More and more HVDC inverters will terminate in the same receiving area, for example, in China Southern Power Grid and East China Power Grid. This paper studies the locations of the HVDC inverter stations in Zhejiang Power Grid. Based on the simulation results by PSS/E-31, this paper analyzes Zhejiang power grid...
With the development of China's power system, more and more HVDC links are located in close proximity in a common AC system and thus multi-infeed HVDC systems are developed. Due to the interaction between AC system and DC systems, as well as the interaction amongst DC systems, the behavior of such multi-infeed HVDC system is much more complicated than a single-infeed HVDC system. This paper investigates...
This paper presents a new algorithm for rapid estimating inter-area oscillation(IAO) mode shapes and corresponding modes using correlation analysis(CA). It firstly extracts a weak damping component strongly associated with objective mode from each tie-line active power signal came from WAMS(Wide Area Measurement System), through a low-pass or band-pass filter which is designed by a priori modal knowledge...
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