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For further understanding of the discoloration of solder surfaces due to oxidation during the assembly and operation of electronic devices, UV–vis and X-ray photoelectron spectroscopic analyses were applied to evaluate the degree of discoloring and identify the surface oxides. The decrease in reflectance of the oxidized solder surface is related to SnO whose absorption band is located within the visible...
This study deals with thermal oxidation behaviour in the liquid state of a commonly-used die-attach solder, Pb–Sn, and its potential Pb-free alternatives (Bi–Ag and Zn–Sn) from viewpoints of thermodynamics and kinetics. The characteristics of the oxidation reaction layers were investigated using XPS, XRD and AES. The superior performance in oxidation prevention of the Zn based alloys can be ascribed...
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