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ZnO is a promising thermoelectric material for high-temperature applications; however, the strong correlation between the electrical and thermal transport properties has limited their simultaneous optimization to achieve superior thermoelectric performance. In this work, defect engineering was applied to solve this problem. The results revealed that by eliminating the intrinsic acceptor defects at...
In the microelectronics industry the flip-chip (FC) technology is broadly used to enhance the packaging density. However, the small size and the unique geometry of the FC solder joints induce the electromigration (EM) reliability issue. In this study, a pair of lead-free solder joints (SAC1205) was EM tested by a current of 7.5 × 103 A/cm2. During the tests, X-ray laminography was applied to observe...
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