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With the electronic packaging techniques and electronic equipments toward a high integration and miniaturization development, high thermal conductivity and excellent thermo-mechanical properties of polymer-based composites have attracted significant attentions in the recent years. SiO2 as a common inorganic filler has been widely used in electronics packaging materials, due to its low coefficient...
The novel liquid epoxy moulding compound (EMC) material with high thermally conductive and good heated resistance was prepared by epoxy, cyanate and alumina filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, SEM, TGA, TMA and DMA, respectively. The results showed that the cyanate ester modified epoxy and...
Ag surface modified carbon nanotubes (CNT) were prepared by electro-less plating method. The thermal interface materials (TIM) were obtained by mixed epoxy and nanotubes. The conductivity of expoxy-Ag coated CNT was much higher than that of epoxy-CNT. The Ag modified CNT is a promising high thermal conductive filler for polymer-based TIM.
Thermal grease have numerous commercial and industrial applications in microelectronics, circuit board, heat exchangers, machniery, and appliances. A high loading of thermally conductive filler is essential to aquire a significant increase of thermal conductivity. In this paper, the alkyl silicone oil as a wetting agent was introduced into thermal grease in order to improve the filler loading. The...
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