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In this paper, an experimental investigation was performed on humidity sensing by using Love wave devices coated with different polymeric layers. The Love wave device consists of two interdigital transducers (IDTs) with a period of 28 μm, an ST-90˚X quartz substrate. Three different films of SU-8, SU-8+PVA and PVA, were spin-coated on the substrate surface by a sol-gel process as the waveguide layer...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Die attach process is widely used to realize the connection between die, device and the rest of the system in electronic packaging. During this process, the die moves under the capillary force induced by the liquidus solder. Such a die tilt phenomenon usually occurs and strongly worsens the reliability and performances of devices. In this paper, we built a numerical model based on fluid minimal free...
We have developed a novel MOCVD reactor, which is called buffered distributed spray (BDS) MOCVD reactor, for the multiple wafer growth of films of III–V materials. In the present study, a fundamental and multi-field model based on the computational fluid dynamic (CFD) simulation of coupled flow, heat and mass transfer is presented to describe the epitaxial growth of gallium nitride (GaN). It is investigated...
In this paper, two factors have been considered which may influence the diameter of tin whisker. One is coating crystal structure around the root of tin whisker; another is crack size in oxide films. For the first factor, four samples have been prepared and uniform conditions to storage are provided. Images from SEM (Scanning Electron Microscope) and EDX (Energy Dispersive X-ray Detector) show that...
Simple experiments were conducted to obtain surface and lamp hold temperatures of a main-stream 4W LED bulb, which is on sale in the market. Two kinds of thermal calculations were also done based on the data from measurements. The total heat dissipation rates in those two thermal calculations are close to each other, which demonstrate that the thermal calculation is feasible for thermal analysis of...
GaN thin film grown on sapphire substrate of 50 mm*50 mm in size are successfully bonded and transferred onto Si substrate using Au-Sn wafer bonding followed by grinding, chemical mechanical polishing (CMP) and dry etching. The GaN/sapphire structures are integrated to receptor Si substrate by thermal pressure bonding process. The bonding medium comprises Au-Sn multilayer composite deposited directly...
This paper presents a method for reconstruction of entire three-dimensional objects based on principles of the rotational stereo. The experimental system, which has three degrees of freedom (two for translation and one for rotation), uses an accurate stage to make all areas of the object surface visible. It only needs one camera to capture images and thus reduces the implementation cost. The object...
As high power LEDs develop rapidly, sapphire substrate on which LED's chips are grown, cannot meet the needs of the increasing performance any longer. Therefore, transfer of the devices from the former sapphire substrates to more thermally and electrically conductive receptor substrates is recommended. Laser peeling has been a new technology of separating films of GaN from the substrate on which they...
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