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The through silicon via (TSV) technology provides a promising option to realize a compact millimeter-wave (mmW) and terahertz (THz) system with high performance. As the fundamental elements in this system, transmission lines (T-lines) and interconnects are very important and therefore studied in this paper. A TSV-based substrate integrated waveguide (SIW) is also characterized. The results show that,...
Transmission lines (T-lines) and interconnects are fundamental components for the millimeter-wave (mmW) and terahertz (THz) circuits. Based on the through-silicon via (TSV) technology, three T-lines, four different interconnects, and one substrate integrated waveguide (SIW) are developed and characterized over a frequency range up to 200 GHz. The results of T-lines show that coplanar waveguide (CPW)...
This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates...
The 3-D integration using through silicon vias (TSVs) is expected to realize compact circuits and systems with high performance and multi-functionality. Based on the TSV technology, a hairpin bandpass filter and a microstrip patch antenna for millimeter-wave (mmW)/terahertz (THz) application are designed and presented in this paper. Additionally, a novel TSV-based solution for the integration of antennas...
A design approach of Lange coupler for Si-substrate monolithic microwave integrated circuits is presented for frequency range up to 170 GHz. A combination of odd- and even-mode impedance theory and 3D EM simulation is proposed to improve the performance of Lange coupler. The value of the even number of the strip lines is determined based on the even-mode impedance calculation according to the process...
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