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The through silicon via (TSV) technology provides a promising option to realize a compact millimeter-wave (mmW) and terahertz (THz) system with high performance. As the fundamental elements in this system, transmission lines (T-lines) and interconnects are very important and therefore studied in this paper. A TSV-based substrate integrated waveguide (SIW) is also characterized. The results show that,...
This paper presents a new concept of 3D transformer structure realized by through silicon via (TSV) technology. A set of different turn ratio transformers have been designed and analyzed. The results show that the proposed 3D TSV transformer possesses good performance with small size. Finally, an AC to DC converter circuit which based on proposed transformer has been designed. The result demonstrates...
The 3-D integration using through silicon vias (TSVs) is expected to realize compact circuits and systems with high performance and multi-functionality. Based on the TSV technology, a hairpin bandpass filter and a microstrip patch antenna for millimeter-wave (mmW)/terahertz (THz) application are designed and presented in this paper. Additionally, a novel TSV-based solution for the integration of antennas...
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