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Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
For the package size, weight and cost advantages, plastic encapsulated techniques have been widely used in the packaging industry. However, due to the inherent seal problem of the plastic materials itself and the mismatched coefficient of thermal expansion (CTE) between the epoxy moulding materials and the various interfaces, many reliability problems are worth of serious consideration. In this paper,...
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
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