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A fabrication technology to realize THz microstrip lines and passive circuit components is developed and tested making use of a plasma-enhanced chemical vapor deposition grown silicon nitride (PECVD SiNx) dielectric membrane. We use 2 μm thick SiNx and 300 nm thick gold layers on sapphire substrates. We fabricate a set of structures for thru-reflect-line (TRL) calibration, with the reflection standard...
In this contribution we review the challenges and possible solutions to achieve accurate s-parameters and power calibration in the (sub)mm-wave bands. A numerical and experimental analysis of multimode propagation over co-planar transmission lines, used during the calibration process, is described. The losses and coupling effects arising from the unwanted propagating modes are analysed by means of...
In this contribution we present a numerical and experimental analysis of the multimode propagation over coplanar transmission lines, in order to define guidelines for substrate selection to achieve accurate wafer-level (sub)mm-wave calibrations. Losses and coupling effects resulting from the multiple propagating modes on transmission lines conventionally employed for probe-level calibrations, are...
In this paper we compare two low cost solutions, e.g. Rogers 5880LZ laminate and a single mask IC processed fused silica wafer, for the implementation of mm-wave antennas. The design, manufacturability and performance of the structures are compared for the wireless HD communication standard. Moreover, the use of ribbon cord bonding is presented and evaluated in terms of its performance for mm-wave...
In this letter, we report, for the first time, a silicon-filled integrated waveguide based on a two mask integrated circuit (IC) process and substrate transfer technique. The fabrication process offers a high degree of control and repeatability on the device geometrical dimensions. Waveguide structures with cutoff frequencies of 35, 50, and 77 GHz were designed and fabricated. In the fundamental TE...
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