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As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb- free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabrication of substrates to support Pb-free Semiconductor BGA product packaging. However, the set back...
Lead-free flux used in lead-free solder ball attachment process has been found to play a vital role in improving lead-free solder joint robustness & performance. In this study, two water soluble lead-free solder ball attach fluxes, flux A & flux B, each from different supplier, were compared in terms of the following characteristics: time variation of flux properties, flux stability vs. temperature...
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