Search results for: Yongping Pu
Ceramics International > 2013 > 39 > Supplement 1 > S217-S220
Ceramics International > 2013 > 39 > 4 > 3507-3510
Ceramics International > 2013 > 39 > 1 > 593-596
Journal of Electroceramics > 2013 > 30 > 1-2 > 98-101
Journal of Materials Science: Materials in Electronics > 2013 > 24 > 10 > 3958-3962
Journal of Materials Science: Materials in Electronics > 2013 > 24 > 10 > 4105-4112
Ceramics International > 2012 > 38 > 8 > 6699-6704
Materials Letters > 2012 > 86 > Complete > 115-118
Materials Letters > 2012 > 76 > Complete > 222-225
Powder Technology > 2012 > 219 > Complete > 244-248
Sensors & Actuators: A. Physical > 2012 > 173 > 1 > 158-162
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 3 > 766-771
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 8 > 1599-1603
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 2 > 612-617
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 6 > 1193-1196
Journal of Alloys and Compounds > 2011 > 509 > 34 > 8561-8566
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 5 > 551-554
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 9 > 1479-1482
Journal of the American Ceramic Society > 93 > 6 > 1527 - 1529