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The ATHENIS_3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile...
This work presents a single-chip integrated Smart Driver, especially suited for inductive loads, although it can be used also for capacitive or resistive loads. The proposed smart driver has been realized in a 0.35 µm HVMOS technology. Besides the power MOS device and the relevant gate driving circuitry, the smart driver has integrated self-monitoring/diagnostic capability, it can sustain the large...
This paper addresses the detection of hydrogen leaks for safety warning systems in automotive applications and the measurement of nitrogen oxide concentration in exhaust gases of zero-emission vehicles. The presented approach is based on the development of accurate models (including nonlinearity and error sources of real building components) for all the system elements: sensors and acquisition chain...
The paper deals with RF tire pressure and temperature monitoring (TPM) systems for automotive. Currently, most systems are characterized by an unidirectional link from the RF TPM sensors on the wheels' rim to the receiving/processing unit on the vehicle chassis. This way the battery-powered transmitter is always active wasting power also in parking mode, when TPM is not required Without a feedback...
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