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Merits of Three-Dimensional (3D) integration offer a technology that meet the requirements of the current trend in many-core processors. However, cost is always the dominant factor of adoption of a new technology. After introduction of a fabrication cost model, 2D, homogeneous 3D and heterogeneous 3D architectures are implemented in eight designs. The fabrication costs of these designs are evaluated...
The convergence of three-dimensional (3D) technology and network-on-chip(NoC), the so-called 3D NoC, bring out new architectures and higher performance than traditional 2D NoCs. However, cost is always the dominant factor of adoption of a new technology. In order to evaluate the economic feasibility of volume production of different architectures of 3D NoCs, we compare the fabrication costs of four...
Reuse of existing designs is one of the most effective means for cost reduction. Three-dimensional (3D) stacking technology makes possible reuse of dies in 3D stack. GNet – a 3D architecture for reusing generic network service dies – is herein proposed to construct a network-on-chip (NoC) by virtue of exploiting reuse of known good dies (KGDs). In GNet, generic network service dies (GNSDs) are KGDs...
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