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Microfield exposure tools continue to play a dominant role in the development of extreme ultraviolet (EUV) resists. Here we present an update on the SEMATECH Berkeley 0.3-NA microfield exposure tool and summarize the latest test results from high-resolution line-space printing. Printing down to 20-nm is presented with large process latitude at 22-nm half-pitch lines. Also presented are line-edge roughness...
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