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Flip chip is one of the packaging techniques for high-performance components. There is a greater demand on integrating more functions in a smaller chip nowadays. This leads to the increase of I/O density. Organic substrate is the bottleneck of the high-density packaging. A silicon interposer with through-silicon vias (TSVs) is commonly used to provide a platform with a high wiring density to redistribute...
Phosphor converted LEDs (pc-LEDs), which employ blue LEDs with yellow phosphor deposition to generate white light illumination is a widely used solid-state lighting source. This paper presents the integration of two major processes, namely, phosphor screen printing and moldless encapsulant dispensing, for wafer level pc-LED packaging. In the present study, the processing procedures and parameters...
A novel encapsulation process for wafer level LED arrays is presented. In this process, 4 inch P-type single crystal silicon wafers served as the substrates for flip-chip mountable LED chips. The wafer substrates were fabricated by wafer level lithography and plating process. An UV curable epoxy was applied as the encapsulant. The encapsulation process takes advantage of square trenches fabricated...
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