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The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints under electrotensile load was characterized, in comparison with those under pure tensile load. Experimental results show that under electrotensile load the stress-strain and strain-time curves of joints exhibit three distinct stages, i.e., the fast deformation stage at the beginning of loading, linear deformation stage and...
The fracture behavior of microscale lead-free Sn-3.0Ag-0.5Cu solder joints under electrotensile load was characterized, in comparison with those under pure tensile load. Experimental results show that under electrotensile load the stress-strain and strain-time curves of joints exhibit three distinct stages, i.e., the fast deformation stage at the beginning of loading, linear deformation stage and...
The solder joint's volume and interfacial reaction during the soldering significantly affect its solidification behavior and microstructure feature; further, the microstructure of the solder matrix and the intermetallic compounds (IMC) have a direct impact on the performance and reliability of the solder joint. In this study, the effects of the solder volume and interfacial reaction on the undercooling...
The influence of the cooling rate and the type of under bump metallization (UBM, i.e., Cu and Ni) on the undercooling and solidification behavior of Sn-Ag-Cu (SAC) based solders (i.e., Sn-1.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu) and their joints was characterized. The results show that the cooling rate has little influence on the undercooling of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder balls,...
Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfacial (Ni, Cu)3Sn4 IMC layer grew thick after aging at 125 °C for 100 h with the formation of local voids and cracks due to volume shrinkage induced by the...
The influence of the pre-existing void in the Cu/Sn-58Bi/Cu solder joint on electromigration behavior was investigated by in-situ SEM observation and focused ion beam (FIB) analysis. The results show that the void with smooth internal surface has no influence on the Bi atom migration, while the one with a sharp notch may easily result in Bi atom congregation and further lead to the formation of cracks...
Most existing works about scheduling and resource allocation for orthogonal frequency division multiplexing (OFDM) based two-way relay networks have focused on immediate relay forwarding. In this paper, we consider relay buffering in delay-tolerant networks. The relay node is aided by two buffers and one for each user, so that it can adaptively decide when to buffer the received packets or to forward...
The rapid development of modern electronic devices and products has proposed a great demand for the continuous scaling down in the dimension of solder joints and interconnect pitches in packaging; accordingly the current density in solder interconnects gets higher and higher. The higher current density can easily result in electromigration (EM) which has been regarded as a serious reliability issue...
The microstructural evolution and mechanical behavior of line-type Ni/Sn3.0Ag0.5Cu/Ni interconnects with a small thickness (or height) of 100 µm during isothermal aging were investigated. Microstructural analysis shows that both (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 IMC phases formed at the interface of the as-reflowed joints; however, after the aging treatment at 125 °C for 100 h or more, the interfacial (Cu,Ni)...
The dimension of solder micro-interconnects has been scaling down to meet the trend of miniaturization of electronic products and devices. In this study, Cu/Sn-0.7Cu-0.05Ni (SCN)/Cu sandwich solder joints with a very small thickness (or height), in the range of 10 to 100 µm, were prepared and the size effect on the microstructure and mechanical behavior of the joints were investigated systematically...
This paper investigates error control at the physical layer of a multicast network using low-density parity-check (LDPC) codes. Packets for transmission are encoded into LDPC codewords. A joint iterative message-passing scheme for decoding LDPC codewords at a receive node in the network is proposed to improve error performance. Also proposed is a split-codeword transmission to provide equal error...
The trajectory tracking control problem of a tracked vehicle with slipping is considered in this paper. The slipping effects are analyzed and modeled as three time-varying parameters, which can be estimated simultaneously with robotpsilas pose using nonlinear estimators such as unscented Kalman filter. Dynamic feedback linearization integrated with a globally exponential stabilizing state feedback...
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