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Theoretical study of solid state diffusion mechanism in low-temperature bonding method based on Cu microcones is reported. A Sn layer was electrodeposited on Cu microcones as well as flat Cu substrate then annealed at bonding temperature 463K. IMC grains of Sn/Cu-microcones diffusion samples grew with a relatively fine and uniform size. Cu 6 Sn 5 crystal orientation in Sn/Cu-microcones...
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