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In this study, the effect of pad shape on current density and temperature distributions in solder joints has been investigated by three dimensional thermo-electrical finite element analysis. The simulation results show that square, hexagonal, octagonal and rounded pads with the same thickness/volume generate different current density and temperature distributions. The maximum current densities in...
Lead-free solder alloy is popular in electronic industry due to its environmental friendly characteristic. However, the interfacial reaction faces the thermal challenge caused by the increased melting temperature of lead-free solder alloy. In the present work, a composite Ni-P-ZrO2 (15 at.% of P) layer was developed by electroless plating as novel under bump metallization (UBM). In order to homogeneously...
Lead-free solder alloy is popular in electronic industry due to its environmental friendly characteristic. However, the interfacial reaction faces the thermal challenge caused by the increased melting temperature of lead-free solder alloy. In the present work, a composite Ni-P-ZrO2 (15 at.% of P) layer was developed by electroless plating as novel under bump metallization (UBM). In order to homogeneously...
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