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This letter reports a microwave power sensor with improved dynamic range based on MEMS cantilever beam. The proposed power sensor is manufactured using GaAs microwave monolithic integrated circuit (MMIC) technology. In this design, a cantilever by-pass coupling structure is adopted for high power detection, while the terminating thermoelectric sensor is utilized for low power detection. The novelty...
In order to minimize the effect of packaging on the microwave performance and the sensitivity at X-band, a packaging theory of an inline coupling RF MEMS power sensor is proposed in this paper. The inline RF MEMS power sensor implemented based on GaAs MMIC technology is flip-attached to a large CPW transmission line fabricated on the ceramic substrate with a low dielectric loss. The design method...
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