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In order to improve the thermal fatigue lifetime of Package-on-Package (PoP), this paper taking PoP thermal reliability the cost and rework into consideration, different edge bonding structure (i.e. 100% edge bonding, 50% edge bonding, and 10% edge bonding) are used to improve thermal reliability. At the same time, the effect of different edge bonding patterns (i.e. only the bottom packege, or both...
According to Solid-State Lighting Manufacturing Roadmap 2009, lower cost and higher reliability are two key necessities for LED lighting. In this paper, an optimization process of thermal design for LED lighting system is carried out from the perspective of system in packaging. Based on the three-dimensional thermo-mechanical model of LED lighting system, the thermal and mechanical performance of...
Light emitting diode (LED) as the new light source has the advantages of power saving, environment-friendly, long lifetime and no pollution compared with fluorescent and incandescent lights. But the disadvantage of LED is low light lumen that only 10%~20% input power transform into the light, and 80%~90% into the heat. The junction temperature of LED is so high as to induce the lifetime declining...
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