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The further miniaturization of electronic devices brings the challenge to the electronic packaging, especially for 3D interconnection as the miscrostructure of the solder joint could be replaced by IMC fully without any solder bulk remain. In this paper, both FE modeling and experimental testing were applied to investigate the stress distribution and the fracture mode of the solder joint under tensile...
BGAs packaging offer high pin counts and lower interconnecting space, and are suitable for high density packaging. However, it is difficult to inspect individual solder joints on BGA assembly by conventional visual methods and need a complicated practice on rework. Ball impact test is a useful method to estimate the reliability of BGA solder joint. In this study, the three-dimensional explicit finite...
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