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Thermally conductive polymer composites, in particular those composed of polymers and carbon-based nanomaterials, are promising for thermal management in electronic devices because they offer high thermal conductivity at low filler loading. The effective thermal properties of these composites exhibit high variability that depend on the topological arrangements and morphological characteristics of...
The thermal conductivity of single crystal silicon can be reduced by the introduction of boundaries at the nanoscale. We present the measured thermal conductivity of single crystal silicon nanobeams patterned with a single row of holes at room temperature: the hole diameter and the spacing vary from 100nm to 250nm and from 200 nm to 800nm, respectively. A steady-state four-probe joule heating measurement...
Vertically aligned carbon nanotube (CNT) arrays can provide the required combination of high thermal conductivity and mechanical compliance for thermal interface applications. Much work in the last 15 years has focused on improving the quality and intrinsic thermal conductivity of the nanotube arrays. Currently the thermal interface resistance between nanotube arrays and surrounding materials limits...
The large temperature gradients experienced by thermoelectric modules induce significant thermal stresses which eventually lead to device failure. The impact of thermal cycling on a commercial thermoelectric module is investigated through characterization of the electrical properties. In this work, we measure the evolution of the thermoelectric and electrical properties with thermal cycling. One side...
Vertically-aligned carbon nanotube (CNT) films offer an attractive combination of properties for thermal interface applications, specifically high thermal conductance and mechanical compliance. In this work, we examine the use of a solder bonding layer to attach and transfer CNT films from the silicon growth substrate onto metalized surfaces. Indium foil is considered as a bonding layer for low-temperature...
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