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The mechanical properties and microscopic mechanism of the solder joint at cryogenic temperature were studied. The effects of temperature and Pb content on the reliability of the solder joint were investigated. The temperature has a significant influence on the shear strength of the solder joint. As the temperature decreases, the shear strength increases continuously, and the shear strength of solder...
We have demonstrated a passively Q-switched Erbium-doped fiber laser using PbS quantum dots polystyrene film (QDPF) as saturable absorbers (SAs). Compared with other SA materials, PbS QDPFs have advantages of broad absorption range, high quantum yield, and facile preparation. We have successfully generated stable Q-switched pulse with a repetition rate of 20.98 kHz. To our knowledge, this is the first...
We demonstrated the passively Q-switched Erbium-doped fiber laser by the microfiber-based PbS quantum dot (QDs) as saturable absorber (SA). Compared with other SA, the microfiber-based PbS QDs had higher thermal damage threshold and tunable spectroscopic properties. We fabricated the microfiber with the diameter of 5.86 μm and the interaction length of 2 mm and the PbS QDs with the peak of absorption...
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The...
The metallurgical structure and mechanical shear performance of replated solder bumps were studied. Firstly, the original lead-free interconnect bumps were removed by melt method and the SnPb solder bumps were soldered on the original soldering interface. Then the cross sections of replated bumps were obtained by polishing and the metallurgical structure and the composition of intermetallic layer...
The upstream of Bi River is originated from the Laping Lead-zinc Mine which is the biggest one in China. Therefore, Bi River was affected by mining activities of Lanping Lead-zinc Mine, and had become a typically polluted river by heavy metals. According to the measurement on the magnetic susceptibility and heavy metal pollution in the sediments of Bi River River, the present situation of heavy metal...
Because of higher assembling density, better electrical and mechanical performances and higher reliability than other package styles, more and more BGA package styles are widely and successfully used. Micro crack induced by process stress becomes one of the critical factors which affect yield and long term reliability of BGA solder joints. It becomes more serious with the application of lead free...
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