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This paper presents a new method for making three-dimensional structure on the surface of an elastomer substrate. In general, micromachining based on lithography process is layer-by-layer fabrication, and the resulting structure is restricted to be two-dimensional. In this paper, we presented that three-dimensional structures were achieved by attaching a thin film partially onto an elastomer. Under...
This paper presents a surface structuring method for a closed micro channel. Because fine photolithography can only be made on a flat surface, it has been difficult to make complicated patterns on the inside walls of non-planar microfluidic channels. Here, we demonstrated that micro-scale hierarchical patterns can be formed on the inside walls of the micro channel simply by depositing a plastic thin...
This paper describes for the first time, monolithic integration of high quality InSb Hall device with Si-LSI. Hall device was connected to Si-LSI with metal and controlled by Si-LSI. Temperature drift of output voltage from Hall device could be made within 2% during wide temperature range from -40 to 125 degree C.
We have developed novel mask materials against HF Vapor release for MEMS/NEMS. Parylene-C has a tolerant material against moisture pass, and then, thin aluminum layer has also tolerant against HF vapor. We combined them together for high tolerance and we have successfully obtained completely non-etched silicon oxide layer under HF vapor exposure by Parylene/Al/Parylene sandwich structure.
Of the possible synthetic substitutes for cellulose cable insulation previously reviewed by Fujita1 and Reed,2 TenaxR paper3 development was discontinued for economic reasons, while kraft/polypropylene (PP) film laminates have been successfully applied to experimental 132 kV4 and 275 kV5 cables. The se laminates have mechanical properties which permit satisfactory taping; however, the PP film involved...
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