The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Silicon carbide (SiC) devices have its unique advantages of high operating temperature, high voltage capability with low switching losses when compared to its silicon counterparts. This paper presents a systematic method for long-term reliability analysis for SiC devices. The reliability block diagrams (RBDs) have been established for a SiC power module with standard wire-bonded package. The reliability...
In this paper, compact power module design and evaluation method is presented for EV application. This method can help to design a high power density power converter.
Reducing switch loss and increasing heat-sinking capability were very important research topic in the high power density inverter for EV/HEV applications. In this paper, an inverter with a new development power module was built. The power module was packed using a hybrid SIC power device to reduce the switching loss and direct cooling technology to decrease the thermal resistance. The double pulse...
The layout of power modules is one of the key points in power module design. In this paper, along with design examples, an improved automatic layout method for planar power module is presented. Some practical considerations and implementations are introduced in the optimization procedure.
The layout of power modules is one of the key points in power module design, especially for high power densities, where couplings are increased. In this paper, along with the design example, a fast and universal layout design method for both wirebond and planar power modules is presented. Some practical considerations and implementations are introduced in the optimization of module layout design.
Intelligent power module (IPM) is known for its excellent features such as high compactness and ease-of-use. Some key points must be taken into account during the designing stage of an IPM. The internal Common-mode electromagnetic interference (CM EMI) is apt to cause an IPM to malfunction in normal operation. A practicable method of PCB layout is proposed in this paper to mitigate the CM EMI inside...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.