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A process for the simultaneous fabrication of through-glass interconnect vias (TGVs) and gold (Au) bumps using dry film resist and submicron Au particles is proposed. A Ti/Pt/Au layer was sputtered on the top and bottom surfaces of glass vias to improve the adhesion between the glass substrate and submicron Au particles. The submicron Au particles filled the resist holes and glass vias fabricated...
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