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A 6.5×6.5 mm2 compact silicon interposer encompassing 2 Tx/Rx antenna, one RF chips, TSV via-last has been designed and fabricated for 60 GHz fast data transmission applications. First characterizations are described in this paper with a focus on reliability, antenna performances and Through-Silicon-Vias (TSV) characterization. It is first shown that more than 500 thermal cycles can be achieved with...
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