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In this paper, a chip level stacked module, 100-µm pitch chip on chip (CoC) interconnection with Cu/Sn/Cu microbumps, was assembled by thermal compression bonding process. Daisy chain circuit in the package is electrically connected to high speed Data Acquisition (DAQ) thus transient resistance and drop number are recorded during drop test. The cross-sectional images of failed samples are inspected...
For the purpose of process R&D on inter-die vertical connection for 3D integration, the role of ultrasonic vibration in forming a low-temperature bonding joint needs to be studied in-depth. Rather than focusing on the ultrasonic-induced interfacial reactions by molten solder, this study used low power ultrasonics to bond solder with flat Ni and microcone-structured Ni substrates respectively under...
An ideal low temperature bonding method was studied. Cu cones were prepared by electroless plating. Heating and pressure were used in the bonding process between Cu cones and Sn-3.0Ag-0.5Cu solder. It's a solid state bonding method because the bonding process was performed below the melting point of solder. Shear strength was measured by bonding tester. Morphologies of Cu cones, fracture surfaces...
In this paper, a novel low-temperature micro-insert bonding technology for 3D package has been reported. Nickel microcone arrays (MCA) fabricated on the bonding pad was used as the under bump metallization (UBM). The bonding temperature is below the melting point of the solder. At certain temperature and pressure, the MCA inserted into the lead-free Sn-Ag-Cu solder bumps to achieve a good adhesion...
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